The basic principle of metal spinning technology of spinning machine is similar to the ancient pottery production technology. The parts formed by spinning are generally rotating cylindrical parts or disc-shaped parts, and the blanks of spinning parts are usually thick-walled cylindrical parts or round plates. The principle and structure of the spinning machine are similar to those of metal cutting lathes. Today’s spinning requires the help of spinning accessories.
The principle of spinning accessories is designed with a rotating wheel frame with axial motion power at the position of the lathe large slide, and the rotating wheel fixed on the rotating wheel frame can move radially. A core mold (shaft) is coaxially connected to the main shaft, and the spinning blank is sleeved on the core mold (shaft). The rotating wheel is passively rotated in the opposite direction by the friction force generated by contact with the blank sleeved on the core mold (shaft). At the same time, the rotating wheel frame moves axially under the action of the axial large thrust cylinder.
Types of spinning pulleys The rotating wheel frame implements point-by-point continuous plastic deformation on the surface of the blank under the joint action of the axial force and the rotating wheel in the radial force. At the position of the lathe tail support, a tail hydraulic cylinder is designed to be coaxial with the main shaft. The hydraulic cylinder applies axial thrust to the end face of the blank sleeved on the core mold (shaft). The base of the spinning accessories is made of aluminum alloy with a thickness of 2mm. Aluminum is in a relatively negative position in the electrochemical sequence, and it has an extremely high affinity for oxygen. These two factors make it difficult to electroplate aluminum and aluminum alloys. After the oxide film on the surface of aluminum and aluminum alloys is removed in alkali solution, a new oxide film is quickly formed when it encounters oxygen in the air. This oxide film seriously affects the bonding strength between the electroplating layer and the substrate.